Why Celazole® U-Series PBI is Perfect for Semiconductor Manufacturing Equipment

Addressing Major Challenges in Semiconductor Manufacturing with Celazole® U-60SD

Semiconductor fabrication ranks among the most demanding manufacturing processes for processing tool materials, requiring non-metallic insulating materials that can withstand high temperatures and aggressive chemistries while maintaining mechanical strength and resisting wear. Celazole® U-60SD is a high purity variant of engineering thermoplastic Celazole® U-60 polybenzimidazole (PBI), making it particularly well-suited for the front end semiconductor wafer processing.

Advantages of Celazole® U-60SD

Celazole® U-60SD stands out as a high-performance polymer engineered to withstand the extreme conditions of semiconductor manufacturing. Its thermal stability, chemical resistance, mechanical strength, high purity and insulative properties make it indispensable for demanding applications.

Below are the key features that set Celazole® U-60SD apart:

• Exceptional Thermal Stability:
  • Glass transition temperature: 427°C (800°F).
  • Heat deflection temperature: 435°C (815°F).
  • Maintains structural integrity under prolonged heat exposure.
• Chemical and Plasma Resistance:
  • Resistant to high etch plasma.
  • Withstands exposure to hydrocarbons, alcohols, cleaning solvents, and most organic solvents.
• High Mechanical Strength:
  • Exceptional tensile and compressive strength.
  • Ideal for applications requiring wear resistance related to wafer contact while not scratching wafers.
• High Purity:
  • Very low ionic metal content.
  • Low particle generation and low wafer contamination.

Where Celazole® U-60SD Excels

Semiconductor equipment manufacturers have turned to Celazole® U-60SD for wafer handling and transfer components such as robotic arm end effectors,  lifting pins, and wafer guides. 

Celazole® U-60SD is also used in chamber seals, shower bushings and other chamber fixtures in CVD and PVD processes.

Real-World Insights

Semiconductor facilities have reported extended part life and longer time between maintenance cycles after replacing lower grade engineering plastic parts with Celazole U-60SD PBI. 

They have also reported lower levels of wafer contamination and improved chip yield. 

Future Trends To Watch For

As semiconductor devices grow smaller and more complex, manufacturing processes will continue pushing temperature, chemical, and cleanliness boundaries. The demand for reliably functional materials in these intense environments will escalate. 

Celazole® U-60SD is well-positioned to meet these evolving needs.

Let’s Work Together

PBI Performance Products, Inc. understands the critical demands of semiconductor manufacturing, where low particle generation, thermal endurance, and chemical resistance are essential. Celazole® U-60SD is designed to meet these challenges. If you’re ready to explore how Celazole® U-60SD can enhance your operations, we’re here to help.

Whether you need to request a sample, find a supplier, or get technical application support, simply fill out our contact form, and a member of our team will be in touch promptly.